1. 2. 3. material content data sheet sales product name igp15n60t issued 29. august 2013 ma# MA001072458 package pg-to220-3-1 weight* 2029.69 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 1.315 0.06 0.06 648 648 leadframe non noble metal iron 7439-89-6 0.816 0.04 402 inorganic material phosphorus 7723-14-0 0.245 0.01 121 non noble metal copper 7440-50-8 815.335 40.18 40.23 401704 402228 wire non noble metal aluminium 7429-90-5 1.380 0.07 0.07 680 680 encapsulation organic material carbon black 1333-86-4 5.975 0.29 2944 plastics epoxy resin - 113.526 5.59 55933 inorganic material silicondioxide 60676-86-0 478.005 23.55 29.43 235507 294384 leadfinish non noble metal tin 7440-31-5 21.462 1.06 1.06 10574 10574 plating non noble metal nickel 7440-02-0 0.244 0.01 120 inorganic material phosphorus 7723-14-0 0.001 0.00 0.01 1 120 solder non noble metal antimony 7440-36-0 0.115 0.01 57 noble metal silver 7440-22-4 0.287 0.01 141 non noble metal tin 7440-31-5 0.747 0.04 0.06 368 566 heatspreader non noble metal iron 7439-89-6 0.590 0.03 291 inorganic material phosphorus 7723-14-0 0.177 0.01 87 non noble metal copper 7440-50-8 589.466 29.04 29.08 290422 290800 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
|
